It has been formulated for die attach application in high power LED and IC.It's excellent rheology avoids tailing or stringing problems in high throughput, automatic die attach equipment.
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It has been formulated for die attach application in high power LED and IC.It's excellent rheology avoids tailing or stringing problems in high throughput, automatic die attach equipment.
Excellent thermal conductivity, electrical conductivity and reliability;
Good dispensability with minimal tailing and stringing;
High adhesion on various materials.
The data above indicate typical values only and are not intended to be used as specification limits.
Bonotec products are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Bonotec Standard Package Data Set or consult your Customer Service Representative.
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