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EXBOND 3300UF

It has been formulated for underfill application. It is electrically insulating adhesive.

+86-021-52272688

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Product introduction

Product description

It has been formulated for underfill application. It is electrically insulating adhesive.

Features

Low viscosity, low Tg point and Coefficient of Thermal Expansion.
Good adhesion on various materials.

Technical parameters

  • Typical Uncured Properties
  • Appearance
  • Viscosity @25°C
  • Work Life@25°C
  • Storage Life@-40°C
  • EXBOND 3300UF
  • Black paste with single component
  • 1K+CP
  • >7days
  • 1year
  • Test Description
  •  
  • Brookfield CP51@5rpm, 25℃
  • 25% increase in viscosity @ RT
  • -40℃
  • 固化条件
  • Cure process Data
  • Recommend Cure condition
  • EXBOND 3300UF
  • 20 minutes@80℃
  • 30 minutes@70℃
  • Test Description
  •  
  •  
  • Physiochemical Properties-Post Cure
  • Glass Transition Temperature
    (Tg)
  • Coefficient of Thermal Expansion
  • Hardness
  • Moisture Absorption
  • Volume Resistivity
  • Die Shear Strength @ 25ºC
  • EXBOND 3300UF
  • 65℃
  • Tg Below Tg 70 ppm/℃
    Tg Above Tg 155 ppm/℃
  • 90D
  • 1.0 wt%
  • <1016  Ω·cm
  • 25℃  22 MPa
    25℃  3.2 MPa
  • Test Description
  • TMA penetration mode
  • TMA expansion mode
  • Shore Durometer
  • 1 hr @Boiled water
  • 4-point probe
  • Al-Al
    Polycarbonate- Polycarbonate

The data above indicate typical values only and are not intended to be used as specification limits.

Bonotec products are packaged in syringes or jars per customer specification. Available package sizes range from 1cc to 30cc and 1 ounce to 1 pound. For details, refer to the Bonotec Standard Package Data Set or consult your Customer Service Representative.

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