Die attach is a very important step in the packaging process. The main purpose of die attach is to grab a single chip from the cut wafer and place it on the substrate.
The main process is shown in the following figure, which can be divided into three steps:1、disperser，2、Pick up，3、Placement。
The main components of silver adhesive are epoxy resin, silver powder and a small amount of additives. Epoxy resin and additives play the role of bonding, while silver powder mainly plays the role of conduction and heat conduction. The finished silver glue is installed in the syringe and stored at - 40 ℃ to prevent denaturation. Before use, take out the silver glue and return it to temperature, mix it evenly in the centrifugal mixer, and extrude the bubbles in it.
©2020 Bonotec Electronic Materials Co.Ltd. All Rights Reserved. Powered by Yongsy
Online message